Total: 45
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
512Kb(64K x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
50 MHz
75 MHz
54 MHz
15ms,5ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad