Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
4Mb(512K x 8)
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
50 MHz
75 MHz
15ms,5ms
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad