Total: 7
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
32Mb(4M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
75 MHz
15ms,5ms
16-SOIC(0.295,7.50mm wide)