Total: 8
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
4Mb(512K x 8)
8Mb(1M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
55ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
32-LCC(J feedthrough)