Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
512Mb(64M x 8)
16Mb(2M x 8)
SPI - Four I/O
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
133 MHz
3ms
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-WDFN Exposed Pad