Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
1Mb(128K x 8)
16Mb(2M x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
75 MHz
3ms
8-SOIC(0.154,3.90mm wide)
8-VDFN Exposed Pad