Total: 23
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
TR,CT,
16Mb(2M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
75 MHz
133 MHz
3ms
8-XFBGA,WLCSP
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-UFDFN Exposed Pad
8-DIP(0.300,7.62mm)
8-XDFN Exposed Pad