Total: 24
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
75 MHz
133 MHz
104 MHz
3ms
8-SOIC(0.209,5.30mm wide)