Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
4Mb(512K x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
80 MHz
70ns
90ns
55ns
32-TFSOP(0.724 ,18.40mm wide)