Total: 33
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
SPI - Four I/O
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
80 MHz
24-TBGA