Total: 16
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
4Mb(512k x 8)
SPI - Four I/O,QPI
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
104 MHz
800µs
30µs,800µs
8-SOIC(0.154,3.90mm wide)