Total: 59
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
128Mb(32M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
1.65V ~ 2V
2.1V ~ 3.6V
1.65V ~ 2.1V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
75 MHz
108 MHz
133 MHz
104 MHz
120 MHz
85 MHz
8ms,2.8ms
8ms,5ms
15ms,5ms
15ms,3ms
8-SOIC(0.209,5.30mm wide)