Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
32Mb(4M x 8)
64Mb(16M x 4)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
108 MHz
8ms,5ms
8-WDFN Exposed Pad