Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
512Mb(64M x 8)
SPI - Four I/O
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
8-WDFN Exposed Pad