Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
16Mb(2M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
SPI - Four I/O
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
50 MHz
75 MHz
133 MHz
104 MHz
15ms,5ms
3ms
7ms
16-SOIC(0.295,7.50mm wide)