Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
512Mb(64M x 8)
SPI - Four I/O,QPI,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
133 MHz
3ms
16-SOIC(0.295,7.50mm wide)