Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
4Gb(512M x 8)
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C
104 MHz
250µs
16-SOIC(0.295,7.50mm wide)