Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
256Mb(32M x 8)
2.7V ~ 3.6V
SPI - Four I/O
-40°C ~ 85°C(TA)
133 MHz
3ms
8-WLGA Exposed Pad