Total: 1
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
512Kb(64K x 8)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
50 MHz
15ms,5ms
8-TSSOP(0.173,4.40mm wide)