Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
32Mb(4M x 8)
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 85°C(TA)
133 MHz
120 MHz
8-UDFN Exposed Pad