Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
TR,CT
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 85°C(TA)
108 MHz
133 MHz
80 MHz
8-UFDFN Exposed Pad