Total: 21
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
512Mb(32M x 16)
64Mb(4M x 16)
128Mb(8M x 16)
1.7V ~ 2V
-40°C ~ 85°C(TC)
52 MHz
85ns
65ns
100ns
88-TFBGA,CSPBGA