Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
64Mb(4M x 16)
128Mb(8M x 16)
3V ~ 3.6V
-40°C ~ 85°C(TA)
0°C ~ 70°C(TA)
200 MHz
54-TSOP(0.400,10.16mm wide)