Total: 81
Samsung
Micron
Hynix
Winbond
nanya
ELPIDA
Etron
ISSI
ProMOS
Alliance Memory
Zentel
DRAM
Flash Memory
RAM
bulk
pallet
TR
box
TR,CT
Volatile
nonvolatile
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(32M x 4)
128Mb(8M x 16)
16Mb Flash Memory,4Mb RAM
16Mb(4M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
1Gb(1G x 1)
768Gb(96G x 8)
1.5Tb(192G x 8)
6Tb(768G x 8)
128Mb(4M x 32)
1Gb(128M x 8)(NAND),256Mb(8M x 32)(LPDRAM)
1Gb(64M x 16)(NAND),512Mb(16M x 32)(LPDRAM)
1Gb(64M x 16)(NAND),256Mb(16M x 16)(LPDRAM)
1Gb(64M x 16)(NAND),256Mb(8M x 32)(LPDRAM)
2Gb(256M x 8)(NAND),1Gb(32M x 32)(LPDRAM)
2Gb(128M x 16)(NAND),1Gb(64M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),2Gb(128M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),2Gb(64M x 32)(LPDRAM)
4Gb(256M x 16)(NAND),2Gb(128M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),4Gb(256M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),4Gb(128M x 32)(LPDRAM)
3V ~ 3.6V
2.5V ~ 3.3V
2.5V ~ 2.7V
1.31V ~ 1.39V,1.46V ~ 1.55V
1.31V ~ 1.65V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-30°C ~ 85°C(TA)
MMC
Paralleling
60-FBGA
366-VFBGA
366-WFBGA
8-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
44-VFBGA
46-TFBGA
46-VFBGA
48-TFSOP(0.173,4.40mm wide)
48-VFBGA
56-TFBGA,CSPBGA
56-VFBGA
64-TFBGA
130-VFBGA
272-LFBGA
169-VFBGA
54-TSOP(0.400,10.16mm wide)
90-VFBGA
86-TFSOP(0.400,10.16mm wide)
66-TSSOP (0,400,10,16mm)
152-VFBGA
190-TFBGA
107-TFBGA
152-TBGA(14x18)
100-TBGA(12x18)
SDRAM
SDRAM - DDR2
EMMC
SGRAM - GDDR5