Total: 64
Samsung
Micron
Hynix
Winbond
nanya
ELPIDA
Etron
ISSI
ProMOS
Alliance Memory
Zentel
pallet
TR
box
TR,CT
Volatile
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(32M x 4)
128Mb(8M x 16)
16Mb Flash Memory,4Mb RAM
16Mb(4M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
1Gb(1G x 1)
768Gb(96G x 8)
1.5Tb(192G x 8)
6Tb(768G x 8)
128Mb(4M x 32)
1Gb(64M x 16)(NAND),512Mb(16M x 32)(LPDRAM)
1Gb(64M x 16)(NAND),256Mb(16M x 16)(LPDRAM)
1Gb(64M x 16)(NAND),256Mb(8M x 32)(LPDRAM)
2Gb(256M x 8)(NAND),1Gb(32M x 32)(LPDRAM)
2Gb(128M x 16)(NAND),1Gb(64M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),2Gb(128M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),2Gb(64M x 32)(LPDRAM)
4Gb(256M x 16)(NAND),2Gb(128M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),4Gb(256M x 16)(LPDRAM)
4Gb(512M x 8)(NAND),4Gb(128M x 32)(LPDRAM)
2.5V ~ 3.3V
2.5V ~ 2.7V
1.31V ~ 1.65V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-30°C ~ 85°C(TA)
MMC
Paralleling
8-SOIC(0.295,7.50mm wide)
8-UDFN Exposed Pad
46-TFBGA
48-VFBGA
64-TFBGA
130-VFBGA
272-LFBGA
169-VFBGA
54-TSOP(0.400,10.16mm wide)
90-VFBGA
54-VFBGA
86-TFSOP(0.400,10.16mm wide)
66-TSSOP (0,400,10,16mm)
152-VFBGA
190-TFBGA
107-TFBGA
FLASH - Boot block
SDRAM
SDRAM - DDR2
SGRAM - GDDR5