符合商品数量共: 162 件
三星(samsung)
镁光(micron)
海力士(sk hynix)
华邦(winbond)
南亚(nanya)
尔必达(ELPIDA)
钰创科技
芯成半导体
茂德科技
Alliance Memory
力积电子(Zentel)
DRAM
闪存
FLASH,RAM
表面贴装型
散装
托盘
卷带(TR)
盒
卷带(TR),剪切带(CT)
袋
FLASH - NAND(SLC)
FLASH - NAND
易失
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
512Mb(128M x 4)
4Gb(512M x 8)(NAND),2G(64M x 32)(LPDDR2)
4Tb(512G x 8)
4Gb(4G x 1)
64Gb(8G x 8)(NAND),8Gb(256M x 32)(LPDDR3)
2Tb(256G x 8)
1Mb(128K x 8)
128Mb(32M x 4)
128Mb(8M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
24Gb(384M x 64)
24Gb(768M x 32)
16Mb(1M x 16)
16Mb(4M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
256Mb(16M x 16),512M(32M x 16)
2Gb(256M x 8,128M x 16)
1Gb(1G x 1)
128Gb(16G x 8)
768Gb(96G x 8)
1.125Tb(144G x 8)
3Tb(384G x 8)
6Tb(768G x 8)
128Mb(4M x 32)
512Mb(16M x 32)
1.55V ~ 1.9V
1.7V ~ 1.9V
2.7V ~ 3.6V
3.135V ~ 3.465V
1.65V ~ 3.6V
2.3V ~ 2.7V
2.5V ~ 2.7V
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
-25°C ~ 85°C(TA)
0°C ~ 70°C(TA)
-20°C ~ 85°C(TA)
-25°C ~ 85°C(TC)
60-FBGA
60-TFBGA
63-FBGA
84-FBGA
92-TFBGA
8-UDFN
132-LBGA
149-WFBGA
模具
8-VDFN 裸露焊盘
23-XFBGA,WLBGA
32-TFSOP(0.724,18.40mm 宽)
78-TFBGA
82-FBGA
8-TSSOP(0.173,4.40mm 宽)
8-XFBGA
8-XFBGA,CSPBGA
44-VFBGA
56-TFBGA,CSPBGA
56-VFBGA
64-TFBGA
80-BQFP
80-LBGA
88-TFBGA
88-TFBGA,CSPBGA
107-TFBGA,CSPBGA
48-TSOP
55-TFBGA
100-VBGA
114-LFBGA
132-TBGA
153-LFBGA
169-LFBGA
272-LFBGA
272-VFBGA
153-TFBGA
169-VFBGA
169-WFBGA
54-TSOP(0.400,10.16mm 宽)
90-VFBGA
54-VFBGA
86-TFSOP(0.400,10.16mm 宽)
60-VFBGA
66-TSSOP (0,400,10,16mm)
144-LFBGA
66-TSSOP (szerokość 0,400,10,16mm)