符合商品数量共: 52 件
三星(samsung)
镁光(micron)
海力士(sk hynix)
华邦(winbond)
南亚(nanya)
尔必达(ELPIDA)
钰创科技
芯成半导体
茂德科技
Alliance Memory
力积电子(Zentel)
DRAM
表面贴装型
卷带(TR),剪切带(CT)
易失
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
512Mb(128M x 4)
128Mb(16M x 8)
128Mb(32M x 4)
128Mb(8M x 16)
16Mb 闪存,4Mb RAM
16Mb(4M x 4)
32Mb(1M x 32)
2.3V ~ 2.7V
2.5V ~ 2.7V
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TA)
-40°C ~ 105°C(TC)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
60-FBGA
60-TFBGA
63-FBGA
63-TFBGA
84-FBGA
84-TFBGA
92-TFBGA
8-VDFN 裸露焊盘
8-WDFN 裸露焊盘
15-XFBGA,WLCSP
23-XFBGA,WLBGA
32-LCC(J 形引线)
32-TFSOP(0.724,18.40mm 宽)
44-SOIC(0.496,12.60mm 宽)
47-TFBGA
48-TFBGA
8-SOIC(0.295,7.50mm 宽)
8-TSSOP(0.173,4.40mm 宽)
8-UFDFN 裸露焊盘
8-XFBGA
8-XFBGA,CSPBGA
24-LBGA
44-SOIC(0.525,13.34mm 宽)
44-VFBGA
48-VFBGA
64-TFBGA
66-TSSOP (0,400,10,16mm)