Total: 104
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pipe
256Mb(16M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
2Gb(2G x 1)
4Gb(256M x 16)
32Gb(4G x 8)
64Gb(8G x 8)
256Gb(32G x 8)
512Gb(64G x 8)
1Tb(128G x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
16Gb(2G x 8)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
1Gb(1G x 1)
128Gb(16G x 8)
256Kb(32K x 8)
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
0°C ~ 85°C(TA)
60-TFBGA
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-LBGA
100-TBGA
152-LBGA
152-VBGA
mould
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-LCC(J feedthrough)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-TSSOP(0.173,4.40mm wide)
100-VBGA
56-TFBGA
28-DIP(0.600,15.24mm)