Total: 41
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pipe
256Mb(16M x 16)
1Gb(128M x 8)
2Gb(2G x 1)
32Gb(4G x 8)
64Gb(8G x 8)
256Gb(32G x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
256Mb(32M x 8,16M x 16)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
1Gb(1G x 1)
128Gb(16G x 8)
-40°C ~ 85°C(TA)
48-TFSOP(0.724,18.40mm wide)
52-VLGA
100-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
100-VBGA
56-TFBGA