Total: 30
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
pipe
256Mb(16M x 16)
1Gb(128M x 8)
32Mb(4M x 8,2M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
-40°C ~ 85°C(TA)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
60-TFBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
56-TFBGA
28-DIP(0.600,15.24mm)