Total: 102
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
TR
1Gb(64M x 16)
1Gb(128M x 8)
2Gb(128M x 16)
2Gb(256M x 8)
4Gb(512M x 8)
2Gb(2G x 1)
4Gb(256M x 16)
4Gb(4G x 1)
8Gb(1G x 8)
8Gb(8G x 1)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
32Mb(4M x 8)
512Kb(64K x 8)
1Gb(1G x 1)
4Gb(512M x 8)(NAND),8Gb(512M x 16)(LPDDR2)
256Kb(32K x 8)
-40°C ~ 105°C(TA)
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
162-VFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-TSSOP(0.173,4.40mm wide)
8-UFDFN Exposed Pad
67-VFBGA