Total: 27
Samsung
Micron
Hynix
GD
Winbond
Toshiba
Cypress
Spansion
ISSI
KIOXIA
bulk
pallet
TR
TR,CT
4Gb(512M x 8)
2Gb(2G x 1)
4Gb(256M x 16)
4Gb(512M x 8)(NAND),4G(128M x 32)(LPDDR4)
4Gb(4G x 1)
8Gb(8G x 1)
-40°C ~ 105°C(TC)
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
149-WFBGA
mould
16-SOIC(0.295,7.50mm wide)