Total: 491
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(32M x 4)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
8Mb(512K x 16)
16Mb(1M x 16)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
2Gb(256M x 8,128M x 16)
2.7V ~ 3.6V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
50 MHz
75 MHz
108 MHz
133 MHz
54 MHz
60ns
70ns
80ns
90ns
95ns
120ns
125ns
1.8ms
8ms,2.8ms
8ms,5ms
15ms,5ms
45ns
55ns
75ns
100ns
105ns
110ns
3ms
15ms,3ms
15ms,7ms
63-TFBGA
8-UDFN
24-TBGA
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-TFSOP(0.724,18.40mm wide)
47-TFBGA
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-UDFN Exposed Pad
24-LBGA
46-TFBGA
46-VFBGA
48-TFSOP(0.173,4.40mm wide)
48-VFBGA
56-VFBGA
64-TFBGA