Total: 3
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
64Mb(8M x 8)
2.7V ~ 3.6V
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
166 MHz
48-TFSOP(0.724,18.40mm wide)
8-SOIC(0.209,5.30mm wide)