Total: 29
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
64Mb(4M x 16)
128Mb(8M x 16)
1Gb(32M x 32)
512Mb(16M x 32)
1.7V ~ 1.9V
1.7V ~ 1.95V
1.7V ~ 2V
3V ~ 3.6V
2.3V ~ 2.7V
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 2V
-40°C ~ 105°C
-40°C ~ 85°C(TA)
-40°C ~ 95°C(TC)
-40°C ~ 105°C(TA)
0°C ~ 85°C(TC)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 125°C
-40°C ~ 85°C(TC)
-25°C ~ 85°C(TC)
200 MHz
15ns
60-TFBGA
84-TFBGA
24-TBGA
54-TSOP(0.400,10.16mm wide)
90-TFBGA
66-TSSOP (szerokość 0,400,10,16mm)
24-VBGA