Total: 52
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
512Kb(64K x 8)
256Kb(32K x 8)
2.3V ~ 3.6V
1.65V ~ 1.95V
-40°C ~ 105°C(TA)
104 MHz
24-TBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-TSSOP(0.173,4.40mm wide)
8-UFDFN Exposed Pad