Total: 5
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
512Kb(64K x 8)
2.3V ~ 3.6V
-40°C ~ 105°C(TA)
104 MHz
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-TSSOP(0.173,4.40mm wide)
8-UFDFN Exposed Pad