Total: 36
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR,CT
8Mb(1M x 8)
2.7V ~ 3.6V
2.3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
1.65V ~ 2V
1.65V ~ 2.1V
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C
100 MHz
75 MHz
108 MHz
133 MHz
33 MHz
80 MHz
104 MHz
120 MHz
15ms,5ms
15ms,3ms
8-SOIC(0.154 ,3.90mm wide)
8-XFBGA,WLCSP
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
8-UFDFN Exposed Pad
8-XFDFN Exposed Pad