Total: 870
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
bulk
pallet
TR
box
TR,CT
CT
pipe
bulk,pallet
pallet,pallet
bulk,pipe
TR,CT,
TR,TR
pipe,pipe
bulk,pallet,pallet
128Mb(16M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
3V ~ 3.6V
1.65V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
1.65V ~ 1.95V
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-25°C ~ 85°C(TA)
0°C ~ 70°C(TA)
-40°C ~ 125°C(TA)
-40°C ~ 85°C(TC)
120 MHz
0°C ~ 85°C(TA)
200 MHz
100 MHz
166 MHz
50 MHz
75 MHz
108 MHz
133 MHz
54 MHz
66 MHz
80 MHz
104 MHz
70ns
90ns
1.8ms
8ms,2.8ms
8ms,5ms
15ms,5ms
110ns
3ms
15ms,7ms
8-SOIC(0.209 ,5.30mm wide)
16-SOIC(0.295 ,7.50mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
16-UFBGA,WLCSP
23-UFBGA,WLCSP
35ns
36ns
60µs,5ms
24-TBGA
63-VFBGA
mould
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
15-XFBGA,WLCSP
16-SOIC(0.295,7.50mm wide)
56-TFSOP(0.724,18.40mm wide)
64-LBGA
8-UDFN Exposed Pad
56-TFBGA,CSPBGA
8-DIP(0.300,7.62mm)
21-UFBGA,WLCSP
21-XFBGA,WLCSP
8-SOIC
24-VBGA
24-BGA(6x8)
8-WSON(5x6)