Total: 2
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
512Kb(64K x 8)
2.3V ~ 3.6V
-40°C ~ 85°C(TA)
104 MHz
800µs
8-SOIC(0.154,3.90mm wide)
8-UFDFN Exposed Pad