Total: 12
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
pipe
64Mb(8M x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
133 MHz
3ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-UFDFN Exposed Pad
8-XDFN Exposed Pad