Total: 131
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
75 MHz
133 MHz
80 MHz
104 MHz
3ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
8-DIP(0.300,7.62mm)
8-XDFN Exposed Pad