Total: 11
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
512Mb(64M x 8)
2Gb(256M x 8)
2.7V ~ 3.6V
SPI - Four I/O,QPI,DTR
1.65V ~ 2V
-40°C ~ 85°C(TA)
166 MHz
133 MHz
24-LBGA,CSPBGA
24-TBGA
8-WDFN Exposed Pad