Total: 299
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
2Gb(512M x 4)
4Gb(512M x 8)
8Gb(1G x 8)
2Mb(256K x 8)
4Mb(512K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
-40°C ~ 85°C(TA)
86 MHz
120 MHz
166 MHz
108 MHz
133 MHz
80 MHz
104 MHz
16 ns
20ns
30ns
70ns
90ns
120ns
45ns
55ns
100ns
110ns
48-TFSOP(0.724 ,18.40mm wide)
32-TFSOP(0.724 ,18.40mm wide)
24-TBGA,CSPBGA
56-TFSOP(0.724 ,18.40mm wide)
64-LBGA,CSPBGA
48-LFBGA,CSPBGA
48-TFBGA,CSPBGA
48-WFBGA,CSPBGA
44-SOIC(0.496 ,12.60mm wide)
48-TFSOP(0.488,12.40mm wide)
24-TBGA
63-VFBGA
8-WDFN Exposed Pad
32-LCC(J feedthrough)
56-TFBGA,CSPBGA