Total: 18
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
32Mb(4M x 8)
SPI - Four I/O
SPI - Four I/O,QPI
1.65V ~ 2V
-40°C ~ 85°C(TA)
133 MHz
104 MHz
120 MHz
8-SOIC(0.209 ,5.30mm wide)
12-XFBGA,WLCSP
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
8-UDFN Exposed Pad
10-XFBGA,WLCSP