Total: 190
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
TR
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
4Gb(512M x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
128Mb(16M x 8)
128Mb(32M x 4)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
2.7V ~ 3.6V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C
-40°C ~ 85°C(TA)
-40°C ~ 105°C(TA)
-40°C ~ 125°C(TA)
166 MHz
50 MHz
75 MHz
108 MHz
133 MHz
66 MHz
80 MHz
104 MHz
8ms,2.8ms
8ms,5ms
15ms,5ms
3ms
3.5ms
250µs
7ms
16-SOIC(0.295,7.50mm wide)