Total: 12
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
TR,CT
pipe
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
128Mb(16M x 8)
1.7V ~ 2V
SPI - Four I/O,QPI,DTR
-40°C ~ 85°C(TA)
-40°C ~ 125°C(TA)
166 MHz
1.8ms
8ms,2.8ms
24-TBGA
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)