Total: 617
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
256Mb(64M x 4)
512Mb(32M x 16)
512Mb(64M x 8)
512Mb(128M x 4)
1Gb(64M x 16)
1Gb(128M x 8)
1Gb(256M x 4)
2Gb(256M x 8)
1Mb(128K x 8)
2Mb(256K x 8)
2Mb(256K x 8,128K x 16)
4Mb(512K x 8)
4Mb(512K x 8,256K x 16)
8Mb(1M x 8)
8Mb(1M x 8,512K x 16)
16Mb(2M x 8)
16Mb(2M x 8,1M x 16)
32Mb(2M x 16)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(16M x 8,8M x 16)
128Mb(32M x 4)
128Mb(8M x 16)
256Mb(32M x 8,16M x 16)
512Kb(64K x 8)
512Mb(64M x 8,32M x 16)
1Gb(128M x 8,64M x 16)
8Mb(512K x 16)
16Mb(1M x 16)
32Mb(8M x 4)
64Mb(16M x 4)
64Mb(8M x 8)
64Mb(8M x 8,4M x 16)
256Mb(16M x 16),512M(32M x 16)
2Gb(256M x 8,128M x 16)
1.7V ~ 1.95V
2.7V ~ 3.6V
1.7V ~ 2V
2.3V ~ 3.6V
3V ~ 3.6V
4.5V ~ 5.5V
1.65V ~ 2.2V
-40°C ~ 85°C(TA)
166 MHz
40 MHz
50 MHz
52 MHz
75 MHz
108 MHz
133 MHz
54 MHz
66 MHz
60ns
70ns
80ns
85ns
90ns
95ns
120ns
125ns
8ms,2.8ms
8ms,5ms
15ms,5ms
45ns
55ns
65ns
75ns
100ns
105ns
110ns
3ms
15ms,3ms
15ms,7ms
63-TFBGA
8-UDFN
24-TBGA
48-TFSOP(0.724,18.40mm wide)
100-LBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-VDFN Exposed Pad
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
32-TFSOP(0.724,18.40mm wide)
40-TFSOP(0.724,18.40mm wide)
44-SOIC(0.496,12.60mm wide)
47-TFBGA
48-TFBGA
56-TFSOP(0.724,18.40mm wide)
64-LBGA
64-TBGA
8-UDFN Exposed Pad
24-LBGA
44-VFBGA
46-TFBGA
46-VFBGA
48-TFSOP(0.173,4.40mm wide)
48-VFBGA
56-VFBGA
64-TFBGA
80-LBGA
88-VFBGA
133-VFBGA