Total: 105
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
256Mb(16M x 16)
256Mb(32M x 8)
512Mb(64M x 8)
1Gb(128M x 8)
2Gb(256M x 8)
2Mb(256K x 8)
8Mb(1M x 8)
16Mb(2M x 8)
32Mb(4M x 8)
32Mb(4M x 8,2M x 16)
64Mb(4M x 16)
128Mb(16M x 8)
128Mb(8M x 16)
64Mb(8M x 8)
512Mb(16M x 32)
1Gb(NAND),512Mb(LPDDR2)
2Mb(256k x 8)
1.7V ~ 1.95V
2.7V ~ 3.6V
2.3V ~ 3.6V
3V ~ 3.6V
2.3V ~ 2.7V
1.14V ~ 1.95V
SPI - Four I/O
SPI - Four I/O,QPI
SPI - Four I/O,QPI,DTR
SPI - Four I/O,DTR
1.65V ~ 1.95V
-40°C ~ 85°C(TA)
200 MHz
400 MHz
166 MHz
40 MHz
133 MHz
80 MHz
104 MHz
22 ns
15ns
25ns
70ns
3ms
800µs
3.5ms
5ms
30µs,800µs
60-TFBGA
24-TBGA
48-TFSOP(0.724,18.40mm wide)
63-VFBGA
121-WFBGA
8-SOIC(0.154,3.90mm wide)
8-SOIC(0.209,5.30mm wide)
8-WDFN Exposed Pad
16-SOIC(0.295,7.50mm wide)
48-TFBGA
8-UFDFN Exposed Pad
54-TSOP(0.400,10.16mm wide)
134-VFBGA
8-WLGA Exposed Pad
90-TFBGA
66-TSSOP (szerokość 0,400,10,16mm)