Total: 14
Micron
GD
Winbond
Mxic
Cypress
Spansion
ISSI
pallet
TR
256Mb(32M x 8)
512Mb(64M x 8)
64Mb(4M x 16)
128Mb(8M x 16)
512Mb(16M x 32)
1.7V ~ 1.95V
1.7V ~ 2V
3V ~ 3.6V
2.3V ~ 2.7V
SPI - Four I/O,DTR
1.65V ~ 2V
2.7V ~ 2.3V
-40°C ~ 85°C(TA)
200 MHz
15ns
68-XFBGA,WLCSP
24-TBGA
54-TSOP(0.400,10.16mm wide)
90-TFBGA
54-TFBGA
66-TSSOP (szerokość 0,400,10,16mm)
24-VBGA